ULP SPI NOR Flash –Summary

•Features

–Density from 512Kb to 256Mb, for code and data storage

–U series, wide supply : 1.65 to 3.60V

–L series, low voltage :1.65 to 2.00V

–H series, high voltage :2.30 to 3.60V

–Ultra low power (ULP)

–Deep power down 100nA at 1.8V,  500nA at 3.3V (4Mb)

–Program/Erase 2mA

–Flexible program and erase

–Support Page Erase

–Support Dual page (8/16M) or Quad page (32M/64M) Program / Erase

–High reliability

–200K cycling, 20 Year data retention

–Support 125C (P25Q –E Series)

•Application

–Emphasis on IoT, Blue tooth, Portable devices, and Wearable application

–Very suitable for MCP (SiP) with SoC main-chip

–Compatible  & competitive for universal/traditional applications

SPI NOR Flash –Overview

•Focused on Connectivity, Smart H/W & Mobile Phone

–Connectivity:BT Audio, BLE, IoT, NB-IoT, PLC

Partnership with Qualcomm-CSR & Dialog

–Smart HW:Wearable, finger print, touch sensor

–Mobile phone:AMOLED, TDDI, 3D-CCM

Flash Memory